Unipolar Switching Behaviors of RTO $\hbox{WO}_{X}$ RRAM

Wei-Chih Chien, Y.C. Chen, Erh-Kun Lai, Y. D. Yao, Peng Lin, S. F. Horng, Jingjing Gong, T.H. Chou, Hsuan-Yu Lin, M.N. Chang,

IEEE Electron Device Letters · 2010 · 108 citations · 10 references

Concepts

Abstract

The microstructure and electrical properties of the WO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">X</sub> -based resistive random access memory are investigated in this letter. The WO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">X</sub> layer is formed by converting the surface of the W plug with a CMOS-compatible rapid thermal oxidation process. The conductive-atomic-force-microscopy result indicates that nanoscale conducting channels exist in the WO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">X</sub> layer and result in a low initial resistance. This letter studies the unipolar operation- the programming, reading, and reliability behaviors of the device are characterized systematically. The low programming voltages for RESET (3.3 V/50 ns) and fast SET speed (3 V/300 ns) are achieved along with cycling endurance greater than 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">7</sup> times. In addition, the device is immune to read disturb. A 2-bit/cell operation is also demonstrated for high-density applications.

References

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