2007 · 54 citations · 2 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice CharacterizationDevice ReliabilityMemory DevicesMemristive MaterialsOxide SemiconductorsSemiconductor ReliabilityConductionElectronic ConductionMemory ReliabilityMemristive MemoryNonvolatile Memory MaterialsOhmic ConductionOxide ReliabilityResistive Random-access Memory
WO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> formed by plasmas oxidation shows promising multi-bit/cell resistance memory characteristics (ChiaHua Ho et al., 2007). The simple memory is completely self-aligned, requiring no additional masks and has a small 6F <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> cell size. In this work we introduce a graded oxide device that is highly reliable (250degC baking for > 2,000 hrs). The conduction mechanism and factors affecting the memory reliability are examined extensively.
2
Conduction in glasses containing transition metal ions
N. F. Mott · Journal of Non-Crystalline Solids · 1968 · 2.6K citations
Reproducible resistance switching in polycrystalline NiO films
Sunae Seo, Myoung‐Jae Lee, David H. Seo et al. · Applied Physics Letters · 2004 · 934 citations
Natural Sciences, Materials Engineering, Materials Science +16