MEMS post-packaging by localized heating and bonding

Abstract

This work addresses important post-packaging issues for microsystems and recommends specific research directions by localized heating and bonding. Micropackaging has become a major subject for both scientific research and industrial applications in the emerging field of microelectromechanical systems (MEMS). Establishing a versatile post-packaging process not only advances the field but also speeds up the product commercialization cycle. A review of engineering bases describing current technologies of MEMS packaging and wafer bonding is followed by an innovative post-packaging approach by localized heating and bonding, process demonstrations by selective encapsulation are presented, including an integrated low pressure chemical vapor deposition (LPCVD) sealing process, localized silicon-gold eutectic bonding, localized silicon-glass fusion bonding, localized solder bonding and localized CVD bonding processes.