Microelectromechanical System Packaging is the specialized engineering process of encasing and interconnecting microelectromechanical systems to protect their delicate structures while enabling electrical, mechanical, and thermal functionality within operational environments.
106
Publications
4.7K
Citations
392
Authors
117
Institutions
Publications per year
2017–2026
15
Parents
Publications
106
Andreas Fischer, Fredrik Forsberg, Martin Lapisa et al. · Microsystems & Nanoengineering · 2015 · 355 citations · Full text
Engineering, Computer Engineering, Electrical Engineering +17
1–5 of 106
Institutions
117
University of Colorado Boulder
Boulder, United States
6 h-index
13 publications
625 citations
Georgia Institute of Technology
Atlanta, United States
5 h-index
21 publications
675 citations
CEA Grenoble
Grenoble, France
3 h-index
21 publications
518 citations
Commissariat à l'Énergie Atomique et aux Énergies Alternatives
Paris, France
3 h-index
21 publications
518 citations
Chinese Academy of Sciences
Beijing, China
3 h-index
16 publications
318 citations
University of Michigan
Ann Arbor, United States
3 h-index
6 publications
527 citations
Sandia National Laboratories California
Livermore, United States
3 h-index
10 publications
264 citations
Agency for Science, Technology and Research
Singapore, Singapore
3 h-index
10 publications
658 citations
1–8 of 117
Venues
- Journal of Microelectromechanical Systems
10 publications · 406 citations
10
h-index
- IEEE Transactions on Advanced Packaging
7 publications · 425 citations
7
h-index
- Journal of Micromechanics and Microengineering
JMM · 6 publications · 489 citations
6
h-index
- Sensors and Actuators A Physical
5 publications · 257 citations
5
h-index
- Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
5 publications · 244 citations
5
h-index
1–5