Concepedia

J. B. Lasky

JB

Statistics

Publications

15

Citations

1.5K

H-Index

12

Active since

1977

Affiliations

IBM (United States)(Current)

IBM Research - Thomas J. Watson Research Center

University of Wisconsin–Madison

Essex Westford School District

J. B. Lasky is an author at IBM (United States) specializing in materials science, engineering, and electronic materials.

Publications per year

1977–2002

15

Publications

15

Wafer bonding for silicon-on-insulator technologies

J. B. Lasky · Applied Physics Letters · 1986 · 574 citations

Engineering, Electrical Engineering, Materials Science +17

Comparison of transformation to low-resistivity phase and agglomeration of TiSi/sub 2/ and CoSi/sub 2/

J. B. Lasky, James Nakos, O.J. Cain et al. · IEEE Transactions on Electron Devices · 1991 · 346 citations

Natural Sciences, Materials Engineering, Materials Science +17

Transient boron diffusion in ion-implanted crystalline and amorphous silicon

T. O. Sedgwick, A. E. Michel, V. R. Deline et al. · Journal of Applied Physics · 1988 · 174 citations

Engineering, Materials Engineering, Materials Science +17

Silicon-on-insulator (SOI) by bonding and ETCH-back

J. B. Lasky, S. R. Stiffler, F. White et al. · 1985 · 69 citations

Engineering, Electrical Engineering, Materials Science +17

The evolution of IBM CMOS DRAM technology

E.L. Adler, J. DeBrosse, Steven J. Holmes et al. · IBM Journal of Research and Development · 1995 · 51 citations

Engineering, Computer Engineering, Electrical Engineering +17

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