Concepedia

Fusion Bonding

Fusion Bonding is a wafer bonding technique that belongs to the class of direct bonding methods, distinguished by the formation of a strong, hermetic interface between two surfaces through atomic-level bonding facilitated by surface activation and annealing without the use of an intermediate bonding layer.

147

Publications

7.8K

Citations

552

Authors

169

Institutions

Publications per year

2017–2026

26

Parents

Publications

147

Three-dimensional integrated circuits

Anna W. Topol, Douglas Charles La Tulipe, D.J. Frank et al. · IBM Journal of Research and Development · 2006 · 701 citations

, , +17

Fusion Bonding/Welding of Thermoplastic Composites

Ali Yousefpour, Mehdi Hojjati, J.-P. Immarigeon · Journal of Thermoplastic Composite Materials · 2004 · 483 citations

, , +15

Fabrication and characterization of 20 nm planar nanofluidic channels by glass–glass and glass–silicon bonding

Pan Mao, Jongyoon Han · Lab on a Chip · 2005 · 245 citations

, , +17

Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging

Yu‐Ting Cheng, Liwei Lin, K. Najafi · Journal of Microelectromechanical Systems · 2000 · 230 citations

, , +17

Semiconductor wafer bonding via liquid capillarity

Z. L. Liau · Applied Physics Letters · 2000 · 200 citations

, , +17

1–5 of 147

Authors

552

  1. KP
    K. Petersen

    Technical University of Denmark, Denmark

    9 publications · 610 citations

    9

    h-index

  2. NM
    N.I. Maluf

    Stanford University, United States

    8 publications · 600 citations

    8

    h-index

  3. EK
    E.H. Klaassen

    Stanford University, United States

    5 publications · 343 citations

    5

    h-index

  4. JN
    J.M. Noworolski

    University of California, Berkeley, United States

    5 publications · 343 citations

    5

    h-index

  5. JB
    Joe Brown

    Stanford SystemX Alliance

    5 publications · 527 citations

    5

    h-index

1–5 of 552

Institutions

169

  1. Stanford University

    Stanford, United States

    7 h-index

    19 publications

    1.6K citations

  2. University of California, Berkeley

    Berkeley, United States

    7 h-index

    7 publications

    698 citations

  3. University of Twente

    Enschede, The Netherlands

    5 h-index

    25 publications

    484 citations

  4. University of Delaware

    Newark, United States

    5 h-index

    11 publications

    857 citations

  5. Stanford SystemX Alliance

    Stanford, United States

    4 h-index

    13 publications

    1.2K citations

  6. University of California, Santa Barbara

    Santa Barbara, United States

    4 h-index

    10 publications

    339 citations

  7. Tongji University

    Shanghai, China

    4 h-index

    11 publications

    451 citations

  8. Uppsala University

    Uppsala, Sweden

    4 h-index

    16 publications

    467 citations

1–8 of 169

Venues

  1. Journal of Micromechanics and Microengineering

    JMM · 17 publications · 513 citations

    14

    h-index

  2. Sensors and Actuators A Physical

    9 publications · 834 citations

    9

    h-index

  3. Polymer Engineering and Science

    7 publications · 361 citations

    7

    h-index

  4. Journal of Microelectromechanical Systems

    6 publications · 331 citations

    6

    h-index

  5. Journal of Thermoplastic Composite Materials

    JTCM · 5 publications · 892 citations

    5

    h-index

1–5