Z. L. Liau

Semiconductor wafer bonding via liquid capillarity

Z. L. Liau · Applied Physics Letters · 2000 · 198 citations

Materials Science, Materials Engineering, Wafer Scale Processing +15

Wafer fusion: A novel technique for optoelectronic device fabrication and monolithic integration

Z. L. Liau, D.E. Mull · Applied Physics Letters · 1990 · 184 citations

Engineering, Device Integration, Optoelectronic Devices +21

Influence of atomic mixing and preferential sputtering on depth profiles and interfaces

Z. L. Liau, B-Y. Tsaur, J. W. Mauer · Journal of Vacuum Science and Technology · 1979 · 160 citations · Full text

Preferential Sputtering, Engineering, Uniform Mixing +17

Sputtering of PtSi

Z. L. Liau, J. W. Mayer, W. L. Brown et al. · Journal of Applied Physics · 1978 · 156 citations

Engineering, Nuclear Physics, Ion Beam Instrumentation +20

Ion-beam-induced silicide formation

B-Y. Tsaur, Z. L. Liau, J. W. Mayer · Applied Physics Letters · 1979 · 135 citations

Materials Science, Ion Implantation, Engineering +12