J. Logan

Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures

E.H. Klaassen, K. Petersen, J.M. Noworolski et al. · Sensors and Actuators A Physical · 1996 · 192 citations

Engineering, Materials Engineering, Materials Science +14

Sub-μm, planarized, Nb-AlO<i>x</i>-Nb Josephson process for 125 mm wafers developed in partnership with Si technology

M. B. Ketchen, D.J. Pearson, A. W. Kleinsasser et al. · Applied Physics Letters · 1991 · 108 citations

Engineering, Electrical Engineering, Materials Science +17

Silicon Fusion Bonding and Deep Reactive Ion Etching a New Technology for Microstructures

E.H. Klaassen, K. Petersen, J.M. Noworolski et al. · Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95 · 2005 · 78 citations

Engineering, Manufacturing Engineering, Materials Science +17

Process for in-plane and out-of-plane single-crystal-silicon thermal microactuators

J.M. Noworolski, E.H. Klaassen, J. Logan et al. · Sensors and Actuators A Physical · 1996 · 38 citations · Full text

Engineering, Manufacturing Engineering, Materials Engineering +17

Fabrication of SOI wafers with buried cavities using silicon fusion bonding and electrochemical etchback

J.M. Noworolski, E.H. Klaassen, J. Logan et al. · Sensors and Actuators A Physical · 1996 · 24 citations

Engineering, Materials Engineering, Materials Science +17