Texture investigation of copper interconnects with a different line width

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

Engineering, Materials Engineering, Materials Science +16

Copper Metallization for High Performance Silicon Technology

R. Rosenberg, D. Edelstein, C.‐K. Hu et al. · Annual Review of Materials Science · 2000 · 423 citations

Engineering, Electrical Engineering, Materials Engineering +16

Microstructure control in semiconductor metallization

J. M. E. Harper, K. P. Rodbell · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1997 · 163 citations

Natural Sciences, Materials Engineering, Materials Science +17

The evolution of recrystallization textures from deformation textures

Dong Nyung Lee · Scripta Metallurgica et Materialia · 1995 · 145 citations

Natural Sciences, Materials Engineering, Materials Science +14

Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance

Linda Vanasupa, Young‐Chang Joo, Paul R. Besser · Journal of Applied Physics · 1999 · 108 citations

Natural Sciences, Materials Engineering, Materials Science +15