K. Mirpuri - Concepedia

Author

K. Mirpuri

McGill University

Also Known As

K. Mirpuri, K.J. Mirpuri, Kabir-kumar Mirpuri, Kabirkumar J. Mirpuri, Kabirkumar Mirpuri

Publications

163

Citations

H-Index

Concepts

All Affiliations

McGill University Leibniz Institute for Solid State and Materials Research

About

K. Mirpuri is an author at McGill University specializing in materials science, engineering, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	137
2	Materials Science	8	8	137
3	Applied Physics	7	7	121
4	Materials Engineering	4	4	51
5	Electrical Engineering	1	1	36

K. Mirpuri

Publications

137

Citations

H-Index

Page 1

	Year	Citations
Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy Huxiao Xie, DR Friedman, K. Mirpuri, Journal of Electronic Materials Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringScanning Electron Microscopy	2013	36
Texture evolution in Copper film at high temperature studied in situ by electron back-scatter diffraction K. Mirpuri, H. Wendrock, S. Menzel, Thin Solid Films Materials ScienceSurface CharacterizationMaterial AnalysisEngineeringCopper Film	2005	20
Understanding and preventing Cu–Sn micro joint defects through design and process control Michael Njuki, Sanoop Thekkut, Ronit Das, Journal of Applied Electrochemistry Materials ScienceMaterials EngineeringEngineeringProcess ControlManufacturing Engineering	2021	16
Texture investigation of copper interconnects with a different line width Jae‐Young Cho, K. Mirpuri, D. N. Lee, Journal of Electronic Materials Materials ScienceEngineeringApplied PhysicsElectronic PackagingInterconnect (Integrated Circuits)	2005	15
Impact of trench aspect ratio on microstructure variation in as-deposited and annealed damascene Cu interconnect lines K. Mirpuri, Jerzy A. Szpunar Micron Materials ScienceTrench Aspect RatioElectromigration TechniqueEngineeringMicrostructure Variation	2004	15
Impact of annealing, surface/strain energy and linewidth to line spacing ratio on texture evolution in damascene Cu interconnects K. Mirpuri, Jerzy A. Szpunar Materials Characterization Materials EngineeringMaterials ScienceElectromigration Technique3D Ic ArchitectureDamascene Cu Interconnects	2004	13
Superposition of grain size and dispersion strengthening in ODS L12–(Al,Cr)3Ti Martin Heilmaier, Holger Saage, K. Mirpuri, Materials Science and Engineering A Materials ScienceMaterials EngineeringMaterial AnalysisEngineeringApplied Physics	2002	11
Enhanced voiding in Cu-Sn micro joints Michael Njuki, Sanoop Thekkut, Rajesh Sharma Sivasubramony, Materials Research Bulletin Materials ScienceMaterials EngineeringCu-sn Micro JointsEngineeringMicrofabrication	2022	11

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