K. Mirpuri

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy

Huxiao Xie, DR Friedman, K. Mirpuri et al. · Journal of Electronic Materials · 2013 · 36 citations

Materials Science, Electrical Engineering, Electromigration Technique +8

Texture evolution in Copper film at high temperature studied in situ by electron back-scatter diffraction

K. Mirpuri, H. Wendrock, S. Menzel et al. · Thin Solid Films · 2005 · 20 citations

Materials Science, Surface Characterization, Material Analysis +9

Understanding and preventing Cu–Sn micro joint defects through design and process control

Michael Njuki, Sanoop Thekkut, Ronit Das et al. · Journal of Applied Electrochemistry · 2021 · 16 citations

Materials Science, Materials Engineering, Engineering +5

Texture investigation of copper interconnects with a different line width

Jae‐Young Cho, K. Mirpuri, D. N. Lee et al. · Journal of Electronic Materials · 2005 · 15 citations

Materials Science, Engineering, Applied Physics +3

Impact of trench aspect ratio on microstructure variation in as-deposited and annealed damascene Cu interconnect lines

K. Mirpuri, Jerzy A. Szpunar · Micron · 2004 · 15 citations

Materials Science, Trench Aspect Ratio, Electromigration Technique +7