Huxiao Xie - Concepedia

Author

Huxiao Xie

Arizona State University ORCID

Also Known As

H. X. Xie, H. Xie, H.-X. Xie, H.X. Xie, Hengke Xie, Huxiao Xie, Hu‐xiao Xie, Xie Hu

Publications

375

Citations

H-Index

Concepts

All Affiliations

Arizona State University Intel (United Kingdom)Beijing University of Chemical Technology University of New Mexico Intel (United States)

About

Huxiao Xie is an author at Arizona State University specializing in materials science, engineering, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	11	349
2	Chemistry	2	2	77
3	Applied Physics	1	1	36
4	Chemical Engineering	1	1	24
5	Electrical Engineering	1	1	36

Huxiao Xie

Publications

360

Citations

H-Index

Page 1

	Year	Citations
Mechanical properties of intermetallic inclusions in Al 7075 alloys by micropillar compression Sudhanshu S. Singh, Enyu Guo, Huxiao Xie, Intermetallics Materials ScienceMicropillar CompressionEngineeringMechanical PropertiesMechanical Engineering	2015	69
On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints Kyle Yazzie, Huxiao Xie, Jason Williams, Scripta Materialia Materials ScienceFriction WeldingEngineeringSn-based Solder JointsCrack Formation	2012	67
Fabrication of Ag/polypyrrole coaxial nanocables through common ions adsorption effect Aihua Chen, Huxiao Xie, Haiqiao Wang, Synthetic Metals Materials ScienceEngineeringNanomaterialsNanotechnologyNanostructured Polymer	2006	53
Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy Huxiao Xie, DR Friedman, K. Mirpuri, Journal of Electronic Materials Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringScanning Electron Microscopy	2013	36
The synthesis of Ag/polypyrrole coaxial nanocables via ion adsorption method using different oxidants Teng Qiu, Huxiao Xie, Jiangru Zhang, Journal of Nanoparticle Research Materials ScienceChemical EngineeringEngineeringMetal NanoparticlesNanomaterials	2010	24
Mechanical shock behavior of Sn–3.9Ag–0.7Cu and Sn–3.9Ag–0.7Cu–0.5Ce solder joints Huxiao Xie, Nikhilesh Chawla Microelectronics Reliability Materials ScienceMechanical Shock BehaviorEngineeringExplosion WeldingMechanical Engineering	2013	22
Mechanisms of deformation in high-ductility Ce-containing Sn–Ag–Cu solder alloys Huxiao Xie, Nikhilesh Chawla, Y.-L. Shen Microelectronics Reliability Materials ScienceMaterials EngineeringEngineeringSevere Plastic DeformationMechanical Engineering	2011	18
Orientation dependence of indentation behavior in Al–SiC nanolaminate composites Carl R. Mayer, Lingwei Yang, Sudhanshu S. Singh, Materials Letters Materials ScienceMaterials EngineeringEngineeringAl–sic Nanolaminate CompositesMechanical Engineering	2016	18
Thermal and Mechanical Stability of Ce-Containing Sn-3.9Ag-0.7Cu Lead-Free Solder on Cu and Electroless Ni-P Metallizations Huxiao Xie, Nikhilesh Chawla, Kabir Mirpuri Journal of Electronic Materials Materials ScienceMaterials EngineeringEngineeringMetallurgical SystemCorrosion	2012	17
Enhancing the Ductility of Sn-Ag-Cu Lead-Free Solder Joints by Addition of Compliant Intermetallics Huxiao Xie, Nikhilesh Chawla Journal of Electronic Materials Materials EngineeringMaterials ScienceEngineeringMechanical EngineeringCompliant Intermetallics	2013	14

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