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Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy

Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringScanning Electron MicroscopyCorrosionApplied PhysicsElectromigration Damage CharacterizationElectronic PackagingSn-3.9ag-0.7cu-0.5ce Solder JointsMicrostructure