Publication | Closed Access
Impact of trench aspect ratio on microstructure variation in as-deposited and annealed damascene Cu interconnect lines
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Citations
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References
2004
Year
Materials ScienceTrench Aspect RatioElectromigration TechniqueEngineeringMicrostructure VariationInterconnect (Integrated Circuits)Applied PhysicsElectronic PackagingMicroelectronicsMicrostructure
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