Sanoop Thekkut

A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes

Luke Wentlent, Thaer Alghoul, Rajesh Sharma Sivasubramony et al. · Microelectronics Reliability · 2019 · 18 citations

Materials Science, Damage Mechanism, Engineering +10

Isothermal Fatigue of Interconnections in Flexible Hybrid Electronics Based Human Performance Monitors

Rajesh Sharma Sivasubramony, Nardeeka Adams, Mohammed Alhendi et al. · 2018 · 17 citations

Electrical Resistance, Engineering, Mechanical Engineering +20

Understanding and preventing Cu–Sn micro joint defects through design and process control

Michael Njuki, Sanoop Thekkut, Ronit Das et al. · Journal of Applied Electrochemistry · 2021 · 16 citations

Materials Science, Materials Engineering, Engineering +5

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

Manu Yadav, Thaer Alghoul, Sanoop Thekkut et al. · Journal of Electronic Packaging · 2021 · 12 citations

Preventing Void Growth Between Ni3Sn4 and Solder

Michael Njuki, Sanoop Thekkut, Ronit Das et al. · Journal of Electronic Materials · 2022 · 12 citations