19
Publications
465
Citations
13
H-Index
2011
Active since
Luke Wentlent is an author at Binghamton University specializing in engineering, materials science, and mechanical engineering.
Top concepts
EngineeringMechanical EngineeringMaterial ScienceMechanics Of MaterialsElectronic PackagingMicrostructureSolid MechanicsHeat TransferThermal EngineeringThermodynamics
Publications per year
2011–2023
19
19
Nanocopper Based Solder-Free Electronic Assembly
K. Schnabl, Luke Wentlent, K. Mootoo et al. · Journal of Electronic Materials · 2014 · 33 citations · Full text
Challenges for the prediction of solder joint life in long term vibration
Farhan Batieha, Sa’d Hamasha, Younis Jaradat et al. · 2015 · 31 citations
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