Statistics
Publications
19
Citations
474
H-Index
13
Active since
2011
Luke Wentlent is an author at Binghamton University specializing in materials science, materials engineering, and mechanical behavior of materials.
Publications per year
2011–2023
19
19
A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
Peter Børgesen, Luke Wentlent, Sa’d Hamasha et al. · Journal of Electronic Materials · 2018 · 50 citations · Full text
Nanocopper Based Solder-Free Electronic Assembly
K. Schnabl, Luke Wentlent, K. Mootoo et al. · Journal of Electronic Materials · 2014 · 33 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +15
Challenges for the prediction of solder joint life in long term vibration
Farhan Batieha, Sa’d Hamasha, Younis Jaradat et al. · 2015 · 31 citations
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