Luke Wentlent - Concepedia

Author

Luke Wentlent

Binghamton University

Also Known As

L. Wentlent, Luke A. Wentlent, Luke Wentlent

Publications

492

Citations

H-Index

Concepts

All Affiliations

Binghamton University Universal Instruments (United States)Texas Instruments (United States)GE Global Research (United States)Tennessee Technological University

About

Luke Wentlent is an author at Binghamton University specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	17	443
2	Applied Physics	4	4	51
3	Chemical Engineering	1	1	33
4	Computer Engineering	1	1	11
5	Electrical Engineering	1	1	11

Luke Wentlent

Publications

465

Citations

H-Index

Page 1

	Year	Citations
Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue Liang Yin, Luke Wentlent, Linlin Yang, Journal of Electronic Materials Materials ScienceFriction WeldingEngineeringPrecipitate CoarseningPb-free Solder Joints	2011	110
A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints Peter Børgesen, Luke Wentlent, Sa’d Hamasha, Journal of Electronic Materials EngineeringHardware ReliabilityMechanical EngineeringSolid MechanicsThermodynamics	2018	49
Nanocopper Based Solder-Free Electronic Assembly K. Schnabl, Luke Wentlent, K. Mootoo, Journal of Electronic Materials EngineeringMechanical EngineeringCopper MaterialChemical EngineeringElectron Microscopy	2014	33
Challenges for the prediction of solder joint life in long term vibration Farhan Batieha, Sa’d Hamasha, Younis Jaradat, EngineeringLife PredictionMechanical EngineeringSolder Joint LifeDeterioration Modeling	2015	31
Statistical Variations of Solder Joint Fatigue Life Under Realistic Service Conditions Sa’d Hamasha, Luke Wentlent, Peter Børgesen IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringLife PredictionMechanical EngineeringDeterioration ModelingDamage Mechanism	2015	27
Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure Babak Arfaei, Luke Wentlent, Shantanu Joshi, Friction WeldingEngineeringMechanical EngineeringElectron MicroscopyThermomechanical Analysis	2012	27
Interpreting accelerated test results for lead free solder joints Sa’d Hamasha, Luke Wentlent, D. Watson, Friction WeldingEngineeringIndustrial EngineeringMechanical EngineeringTest Results	2016	22
Effects of Amplitude Variations on Deformation and Damage Evolution in SnAgCu Solder in Isothermal Cycling Luke Wentlent, Thaer Alghoul, Christopher Greene, Journal of Electronic Materials Materials ScienceEngineeringIsothermal CyclingHot WorkingSnagcu Solder	2018	18
A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes Luke Wentlent, Thaer Alghoul, Rajesh Sharma Sivasubramony, Microelectronics Reliability Materials ScienceDamage MechanismEngineeringMechanicsMechanical Engineering	2019	18
Effects of Laser Selective Reflow on Solder Joint Microstructure and Reliability Luke Wentlent, Mohammed Genanu, Thaer Alghoul Materials ScienceUnique Solder MicrostructuresAdvanced Laser ProcessingEngineeringSolder Joint Properties	2018	17

Page 1