Publication | Open Access
A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
49
Citations
42
References
2018
Year
EngineeringHardware ReliabilityMechanical EngineeringSolid MechanicsThermodynamicsElectronic PackagingHeat TransferThermomechanical AnalysisThermal EngineeringLow-cycle FatigueMechanics Of MaterialsSnagcu Solder Joints
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