C. Greene

A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

Peter Børgesen, Luke Wentlent, Sa’d Hamasha et al. · Journal of Electronic Materials · 2018 · 50 citations · Full text

Engineering, Materials Engineering, Materials Science +14

Interpreting accelerated test results for lead free solder joints

Sa’d Hamasha, Luke Wentlent, D. Watson et al. · 2016 · 22 citations

Engineering, Materials Engineering, Materials Science +16

Design and Development of a 2-Step Rocker Arm

N. Hendriksma, Thomas Kunz, C. Greene · SAE technical papers on CD-ROM/SAE technical paper series · 2007 · 18 citations

Engineering, Design, Actuators +7

A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes

Luke Wentlent, Thaer Alghoul, Rajesh Sharma Sivasubramony et al. · Microelectronics Reliability · 2019 · 18 citations

Engineering, Materials Engineering, Materials Science +17

Constitutive Relations for Finite Element Modeling of SnAgCu in Thermal Cycling -- How Wrong We Were!

Thaer Alghoul, D. Watson, Nardeeka Adams et al. · 2016 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +17