The application of chemical–mechanical polishing for planarizing a SU-8/permalloy combination used in MEMS devices

Mechanical characterization of a new high-aspect-ratio near UV-photoresist

H. Lorenz, M. Laudon, Philippe Renaud · Microelectronic Engineering · 1998 · 192 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +10

UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole

Hyun-Kee Chang, Yong-Kweon Kim · Sensors and Actuators A Physical · 2000 · 104 citations

Engineering, Manufacturing Engineering, Materials Engineering +12

Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics

R.J. Gutmann, Joseph M. Steigerwald, Lü You et al. · Thin Solid Films · 1995 · 57 citations

Natural Sciences, Materials Engineering, Materials Science +12

<title>Chemical-mechanical polishing: enhancing the manufacturability of MEMS</title>

Jeffry J. Sniegowski · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1996 · 34 citations · Full text

Engineering, Manufacturing Engineering, Materials Science +17

Chemical Mechanical Polishing Mechanisms of Low Dielectric Constant Polymers in Copper Slurries

Christopher L. Borst, Dipto G. Thakurta, William N. Gill et al. · Journal of The Electrochemical Society · 1999 · 32 citations

Natural Sciences, Materials Engineering, Materials Science +17