Planarization
Planarization is a substrate preparation technique in MEMS fabrication that belongs to the class of surface modification processes, distinguished by its specific function of achieving a flat, uniform surface topology to enhance subsequent lithographic precision and layer adhesion.
960
Publications
39.7K
Citations
3.8K
Authors
745
Institutions
Publications per year
2017–2026
188
960
ASAP7: A 7-nm finFET predictive process design kit
Lawrence T. Clark, Vinay Vashishtha, L. Shifren et al. · Microelectronics Journal · 2016 · 736 citations · Full text
Converting Ceria Polyhedral Nanoparticles into Single-Crystal Nanospheres
Xiangdong Feng, Dean C. Sayle, Zhong Lin Wang et al. · Science · 2006 · 611 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +17
1–5 of 960
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745

Clarkson University
Potsdam, United States
27 h-index
129 publications
4.8K citations

Hanyang University
Seoul, South Korea
18 h-index
100 publications
2.9K citations
University of Arizona
Tucson, United States
18 h-index
78 publications
2.5K citations
Massachusetts Institute of Technology
Cambridge, United States
18 h-index
79 publications
4.3K citations
Materials Processing (United States)
Irving, United States
16 h-index
40 publications
2.3K citations
IBM (United States)
Armonk, United States
16 h-index
87 publications
2.4K citations
Tsinghua University
Beijing, China
16 h-index
86 publications
4K citations

Chinese Academy of Sciences
Beijing, China
15 h-index
101 publications
4.1K citations
1–8 of 745
JES · 109 publications · 4.4K citations
40
h-index
JSS · 38 publications · 822 citations
19
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JACS · 18 publications · 3.2K citations
18
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JJAP · 44 publications · 889 citations
18
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23 publications · 943 citations
17
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