Planarization

Planarization is a substrate preparation technique in MEMS fabrication that belongs to the class of surface modification processes, distinguished by its specific function of achieving a flat, uniform surface topology to enhance subsequent lithographic precision and layer adhesion.

960

Publications

39.7K

Citations

3.8K

Authors

745

Institutions

Publications per year

2017–2026

188

Authors

3.8K

  1. SV
    S. V. Babu

    Clarkson University, United States

    29 publications · 1.3K citations

    22

    h-index

  2. DR
    D. Roy

    Clarkson University, United States

    25 publications · 947 citations

    19

    h-index

  3. AP
    Ara Philipossian

    University of Arizona, United States

    23 publications · 682 citations

    18

    h-index

  4. DS
    Duane S. Boning

    Massachusetts Institute of Technology, United States

    13 publications · 571 citations

    12

    h-index

  5. JP
    Jea‐Gun Park

    Hanyang University, South Korea

    11 publications · 245 citations

    11

    h-index

1–5 of 3.8K

Venues

  1. Journal of The Electrochemical Society

    JES · 109 publications · 4.4K citations

    40

    h-index

  2. ECS Journal of Solid State Science and Technology

    JSS · 38 publications · 822 citations

    19

    h-index

  3. Journal of the American Chemical Society

    JACS · 18 publications · 3.2K citations

    18

    h-index

  4. Japanese Journal of Applied Physics

    JJAP · 44 publications · 889 citations

    18

    h-index

  5. Applied Physics Letters

    23 publications · 943 citations

    17

    h-index

1–5