Development of micro assembly processes for further miniaturization in electronics production

Foreword contributions from the 50th electronic components and technology conference

R. Boudreau · IEEE Transactions on Advanced Packaging · 2001 · 519 citations

Engineering, Computer Engineering, Electrical Engineering +16

Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials

Ryan Thorpe, D.F. Baldwin, Brian Smith et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2001 · 24 citations

Engineering, Manufacturing Engineering, Materials Engineering +16

50μm pitch Pb-free micro-bumps by C4NP technology

Bing Dang, Da‐Yuan Shih, Stephen L. Buchwalter et al. · 2008 · 20 citations

Engineering, Manufacturing Engineering, Materials Science +13

A Fluxless and Low-Temperature Flip Chip Process Based on Insertion Technique

Manuel Fendler, Céline Davoine, F. Marion et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 17 citations

Engineering, Electrical Engineering, Materials Science +17

Effects of Surface Roughness on Solder Bump Formation by Direct Droplet Deposition

Jung‐Hoon Chun · CIRP Annals · 2003 · 12 citations

Engineering, Materials Engineering, Materials Science +16