Ryan Thorpe

Multiscale characterization and representation of composite materials during processing

Navid Zobeiry, Alireza Forghani, Chao Li et al. · Philosophical Transactions of the Royal Society A Mathematical Physical and Engineering Sciences · 2016 · 71 citations

Natural Sciences, Materials Engineering, Materials Science +17

High throughput flip chip processing and reliability analysis using no-flow underfills

Ryan Thorpe, D.F. Baldwin, Lawrence P. McGovern · 2003 · 33 citations

Engineering, Manufacturing Engineering, Materials Engineering +16

Liquid Distribution from Cleaning-in-Place Sprayballs

Ken R. Morison, Ryan Thorpe · Food and Bioproducts Processing · 2002 · 28 citations

Engineering, Chemical Engineering, Surface Engineering +7

Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials

Ryan Thorpe, D.F. Baldwin, Brian Smith et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2001 · 24 citations

Engineering, Manufacturing Engineering, Materials Engineering +16

A reliability and failure mode analysis of no flow underfill materials for low cost flip chip assembly

B. Smith, Ryan Thorpe, D.F. Baldwin · 2002 · 16 citations

Engineering, Materials Engineering, Materials Science +17