Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads

Foreword contributions from the 50th electronic components and technology conference

R. Boudreau · IEEE Transactions on Advanced Packaging · 2001 · 519 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +8

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

C.J. Hang, Chunqing Wang, M. Mayer et al. · Microelectronics Reliability · 2007 · 239 citations

Materials Engineering, Materials Science, Growth Behavior +12

Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds

Huining Xu, C. Liu, Vadim V. Silberschmidt et al. · Acta Materialia · 2011 · 238 citations

Materials Science, Materials Engineering, Cu–al Wire Bonds +6

Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

Hyoung-Joon Kim, Joo Yeon Lee, Kyung-Wook Paik et al. · IEEE Transactions on Components and Packaging Technologies · 2003 · 220 citations

Engineering, Mechanical Engineering, Copper Wire +16

Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints

Chih‐Yuan Chen, Weng‐Sing Hwang · MATERIALS TRANSACTIONS · 2007 · 175 citations

Aluminium Nitride, Friction Welding, Engineering +19