Seung Zeon Han

Alloy design strategies to increase strength and its trade-offs together

Seung Zeon Han, Eun‐Ae Choi, Sung Hwan Lim et al. · Progress in Materials Science · 2020 · 244 citations · Full text

Second Phase, Engineering, Mechanical Engineering +18

Ultrathin Silver Film Electrodes with Ultralow Optical and Electrical Losses for Flexible Organic Photovoltaics

Guoqing Zhao, Wenfei Shen, Eunwook Jeong et al. · ACS Applied Materials & Interfaces · 2018 · 112 citations

Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads

Hyung Giun Kim, Sang Min Kim, Jae Young Lee et al. · Acta Materialia · 2013 · 74 citations

Materials Science, Materials Engineering, Electromigration Technique +11

Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound

Seung Zeon Han, Sung Hwan Lim, Sangshik Kim et al. · Scientific Reports · 2016 · 67 citations · Full text

Microstructural characterization of cold-drawn Cu–Ni–Si alloy having high strength and high conductivity

Hwangsun Kim, Jee Hyuk Ahn, Seung Zeon Han et al. · Journal of Alloys and Compounds · 2020 · 59 citations

Materials Engineering, Materials Science, High Strength +8