An As-P(n⁺-n^-)double diffused drain MOSFET for VLSI's

Abstract

An As-P(n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> -n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-</sup> ) double diffused drain is characterized as one of the most feasible device structures for VLSI's from the overall viewpoint of device design. This device makes good use of both As, suitable for microfabrication, and P, in realizing a graded junction. The feasibility of this double diffused drain is investigated comparing it with a conventional As drain over the wide range of effective channel length from 0.5 to 5 µm. We have also succeeded in directly measuring hot-hole gate current as low as on the order of 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-15</sup> A. This current seems to have an important influence on the hot-carrier effects. On the basis of the experiments and simulations using the two-dimensional process/device analysis programs SUPREM and CADDET, it is shown that this device structure provides remarkable improvements, not only in terms of channel hot-electron effects, but also avalanche hot-carrier effects, which are more responsible for hot-carrier related device degradation due to impact ionization at the drain. In addition, this structure has almost the same short channel effect characteristics, for example threshold-voltage lowering as a conventional MOSFET.