Solder joint reliability evaluation of chip scale package using a modified Coffin–Manson equation

Reliability of Controlled Collapse Interconnections

K. C. Norris, Abraham H. Landzberg · IBM Journal of Research and Development · 1969 · 483 citations

Engineering, Electrical Engineering, Heat Transfer +16

Grain-boundary diffusion in some Pb-Sn alloys

James Oberschmidt, K. K. Kim, D. K. Gupta · Journal of Applied Physics · 1982 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +15

Solder joint fatigue life of fine pitch BGAs – impact of design and material choices

Robert Darveaux, Jim Heckman, Ahmer Syed et al. · Microelectronics Reliability · 2000 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +13

Ceramic column grid array for flip chip applications

R.N. Master, Marie Cole, Gregory Martin et al. · 2002 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +13

Ball grid array reliability assessment for aerospace applications

Reza Ghaffarian, Namsoo Kim · Microelectronics Reliability · 1999 · 25 citations

Engineering, Aerospace Engineering, Systems Engineering +14