Yasumitsu Orii

Full intermetallic joints for chip stacking by using thermal gradient bonding

Ting Yang, Takumi Aoki, K. Matsumoto et al. · Acta Materialia · 2016 · 104 citations

Engineering, Materials Engineering, Materials Science +16

IMC bonding for 3D interconnection

Katsuyuki Sakuma, Kuniaki Sueoka, Sayuri Kohara et al. · 2010 · 66 citations

Engineering, Materials Engineering, Materials Science +16

Solder joint reliability evaluation of chip scale package using a modified Coffin–Manson equation

Ikuo Shohji, Hideo Mori, Yasumitsu Orii · Microelectronics Reliability · 2003 · 60 citations

Engineering, Design, Packaging Design +13

Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps

Yasumitsu Orii, Kazushige Toriyama, Hirokazu Noma et al. · 2009 · 46 citations

Engineering, Materials Engineering, Electronic Materials +16

Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack

Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka et al. · 2011 · 32 citations

Engineering, Materials Engineering, Materials Science +17