Kazushige Toriyama

Full intermetallic joints for chip stacking by using thermal gradient bonding

Ting Yang, Takumi Aoki, K. Matsumoto et al. · Acta Materialia · 2016 · 98 citations

Materials Engineering, Materials Science, 3D Ic Architecture +13

Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps

Yasumitsu Orii, Kazushige Toriyama, Hirokazu Noma et al. · 2009 · 46 citations

Flip Chip Technology, Engineering, Advanced Packaging (Semiconductors) +17

Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility

Jae-Woong Nah, Jeffrey D. Gelorme, Peter Sorce et al. · 2014 · 28 citations

Wafer Ims, Engineering, Mechanical Engineering +19

Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

Katsuyuki Sakuma, Kazushige Toriyama, Hirokazu Noma et al. · 2011 · 27 citations

Engineering, Integrated Circuits, Chemistry +19

Micro Structure Observation and Reliability Behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps

Yasumitsu Orii, Kazushige Toriyama, Sayuri Kohara et al. · Transactions of The Japan Institute of Electronics Packaging · 2011 · 25 citations · Full text

Micro Structure Observation, Electrical Engineering, Flip Chip Technology +15