Kazushige Toriyama

Full intermetallic joints for chip stacking by using thermal gradient bonding

Ting Yang, Takumi Aoki, K. Matsumoto et al. · Acta Materialia · 2016 · 104 citations

Engineering, Materials Engineering, Materials Science +16

Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps

Yasumitsu Orii, Kazushige Toriyama, Hirokazu Noma et al. · 2009 · 46 citations

Engineering, Materials Engineering, Electronic Materials +16

Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility

Jae-Woong Nah, Jeffrey D. Gelorme, Peter Sorce et al. · 2014 · 28 citations

Engineering, Materials Engineering, Materials Science +15

Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

Katsuyuki Sakuma, Kazushige Toriyama, Hirokazu Noma et al. · 2011 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +17

Micro Structure Observation and Reliability Behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps

Yasumitsu Orii, Kazushige Toriyama, Sayuri Kohara et al. · Transactions of The Japan Institute of Electronics Packaging · 2011 · 26 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17