Transactions of The Japan Institute of Electronics Packaging

Effects of a Third Element on Microstructure and Mechanical Properties of Eutectic Sn-Bi Solder

Seiki Sakuyama, Toshiya Akamatsu, Keisuke Uenishi et al. · 2009 · 72 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-based Lead-free Solders

Kazuhiro Nogita, Stuart D. McDonald, Hideaki Tsukamoto et al. · 2009 · 46 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Pb-Free High Temperature Solder Joints for Power Semiconductor Devices

Yasushi Yamada, Y. Takaku, Yuji Yagi et al. · 2009 · 30 citations · Full text

Engineering, Materials Engineering, Materials Science +16

Application of Boiling Heat Transfer to High-Heat-Flux Cooling Technology in Power Electronics

Koichi Suzuki, Kazuhisa Yuki, Masataka Mochizuki · 2011 · 28 citations · Full text

Engineering, Electrical Engineering, Mechanical Engineering +17

Micro Structure Observation and Reliability Behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps

Yasumitsu Orii, Kazushige Toriyama, Sayuri Kohara et al. · 2011 · 26 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17