Sayuri Kohara

4.1: A 20‐inch OLED Display Driven by Super‐Amorphous‐Silicon Technology

Takatoshi Tsujimura, Yoshinao Kobayashi, Kohji Murayama et al. · SID Symposium Digest of Technical Papers · 2003 · 74 citations

Electrical Engineering, Engineering, Display Technology +9

IMC bonding for 3D interconnection

Katsuyuki Sakuma, Kuniaki Sueoka, Sayuri Kohara et al. · 2010 · 66 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +16

Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

Kamal Sikka, Ravi Bonam, Yang Liu et al. · 2021 · 43 citations

Robust Assembly Process, Dbhi Package, Bridge Design +14

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori et al. · Journal of Electronic Packaging · 2012 · 25 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +20

Micro Structure Observation and Reliability Behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps

Yasumitsu Orii, Kazushige Toriyama, Sayuri Kohara et al. · Transactions of The Japan Institute of Electronics Packaging · 2011 · 25 citations · Full text

Micro Structure Observation, Electrical Engineering, Flip Chip Technology +15