A 200–225-GHz Manifold-Coupled Multiplexer Utilizing Metal Waveguides

Yinian Feng, Bo Zhang, Yang Liu, +4

IEEE Transactions on Microwave Theory and Techniques

PhotonicsElectrical EngineeringTerahertz TechnologyThz PhotonicsTerahertz Devices +12

Ultra-Compact TSV-Based L-C Low-Pass Filter With Stopband Up to 40 GHz for Microwave Application

Xiangkun Yin, Zhangming Zhu, Yang Liu, +3

IEEE Transactions on Microwave Theory and Techniques

Microwave ApplicationElectrical EngineeringEngineeringHigh-frequency DeviceMixed-signal Integrated Circuit +9

Compact Bandpass Filter and Diplexer With Wide-Stopband Suppression Based on Balanced Substrate-Integrated Waveguide

Xiaoxian Liu, Zhangming Zhu, Yang Liu, +3

IEEE Transactions on Microwave Theory and Techniques

Compact Bandpass FilterFilter (Signal Processing)Microwave TransmissionSiw BpfWide-stopband Suppression +5

Zero Shot Learning via Low-rank Embedded Semantic AutoEncoder

Yang Liu, Quanxue Gao, Jin Li, +2

Few-shot LearningImage AnalysisMachine LearningMachine VisionData Science +11

Wideband Substrate Integrated Waveguide Bandpass Filter Based on 3-D ICs

Xiaoxian Liu, Zhangming Zhu, Yang Liu, +3

IEEE Transactions on Components Packaging and Manufacturing Technology

3D Ic ArchitectureElectrical EngineeringEngineeringThree-dimensional Heterogeneous Integration3-D Ics +9

Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

Kamal Sikka, Ravi Bonam, Yang Liu, +14

Robust Assembly ProcessDbhi PackageBridge DesignChip-scale PackageEngineering +12

A Novel 3-dB Waveguide Hybrid Coupler for Terahertz Operation

Zhongqian Niu, Bo Zhang, Dongfeng Ji, +7

IEEE Microwave and Wireless Components Letters

PhotonicsThz PhotonicsTerahertz SpectroscopyEngineeringWaveguide Coupler +12

Adaptive robust principal component analysis

Yang Liu, Xinbo Gao, Quanxue Gao, +2

Neural Networks

Image AnalysisEngineeringPattern RecognitionMultilinear Subspace LearningPrincipal Component Analysis +3

A Miniatured Passive Low-Pass Filter With Ultrawide Stopband Based on 3-D Integration Technology

Xiangkun Yin, Fengjuan Wang, Qijun Lu, +3

IEEE Microwave and Wireless Components Letters

3-D Integration TechnologyElectrical EngineeringUltrawide StopbandEngineeringFilter Bank +12

Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load

Yang Liu, Chong Yao, Fenglian Sun, +1

Microelectronics Reliability

Package Interconnect Structure3D Ic ArchitectureElectrical EngineeringReliability EngineeringEngineering +12