Kuniaki Sueoka

IMC bonding for 3D interconnection

Katsuyuki Sakuma, Kuniaki Sueoka, Sayuri Kohara et al. · 2010 · 66 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +16

Characterization of stacked die using die-to-wafer integration for high yield and throughput

Katsuyuki Sakuma, Paul Andry, Cornelia Tsang et al. · 2008 · 38 citations

Electrical Resistance, Engineering, Interconnect (Integrated Circuits) +18

Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack

Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka et al. · 2011 · 32 citations

Engineering, Computer Architecture, Thermal Conductivity +20

Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

Katsuyuki Sakuma, Kazushige Toriyama, Hirokazu Noma et al. · 2011 · 27 citations

Engineering, Integrated Circuits, Chemistry +19

Through silicon via process for effective multi-wafer integration

Akihiro Horibe, Kuniaki Sueoka, Takumi Aoki et al. · 2015 · 24 citations

Engineering, Device Integration, Integrated Circuits +18