Akihiro Horibe

Full intermetallic joints for chip stacking by using thermal gradient bonding

Ting Yang, Takumi Aoki, K. Matsumoto et al. · Acta Materialia · 2016 · 98 citations

Materials Engineering, Materials Science, 3D Ic Architecture +13

Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias

M. Murugesan, Hisashi Kino, Hiroshi Nohira et al. · 2010 · 81 citations

Engineering, Mechanical Engineering, Integrated Circuits +22

Through silicon via process for effective multi-wafer integration

Akihiro Horibe, Kuniaki Sueoka, Takumi Aoki et al. · 2015 · 24 citations

Engineering, Device Integration, Integrated Circuits +18

Inter Chip Fill for 3D Chip Stack

Akihiro Horibe, Fumiaki Yamada, C. Feger et al. · Transactions of The Japan Institute of Electronics Packaging · 2009 · 22 citations · Full text

Engineering, Mechanical Engineering, Computer Architecture +18

Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package

Akihiro Horibe, Takahito Watanabe, Chinami Marushima et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 13 citations

Dbhi Silicon-bridge Structure, Engineering, Mechanical Engineering +20