Concepedia

Takumi Aoki

TA

Statistics

Publications

8

Citations

289

H-Index

8

Active since

2004

Affiliations

Doshisha University(Current)

IBM Research - Tokyo

Edogawa University

Japan Society for the Promotion of Science

Ehime University

Takumi Aoki is an author at Doshisha University specializing in engineering, materials science, and chip packaging.

Publications per year

2004–2021

8

Publications

8

Full intermetallic joints for chip stacking by using thermal gradient bonding

Ting Yang, Takumi Aoki, K. Matsumoto et al. · Acta Materialia · 2016 · 104 citations

Engineering, Materials Engineering, Materials Science +16

IMC bonding for 3D interconnection

Katsuyuki Sakuma, Kuniaki Sueoka, Sayuri Kohara et al. · 2010 · 66 citations

Engineering, Materials Engineering, Materials Science +16

Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology

W. Landers, D. Edelstein, L. A. Clevenger et al. · 2004 · 25 citations

Engineering, Electrical Engineering, Materials Science +15

Through silicon via process for effective multi-wafer integration

Akihiro Horibe, Kuniaki Sueoka, Takumi Aoki et al. · 2015 · 24 citations

Engineering, Materials Engineering, Materials Science +17

Incidence and Clinical Significance of Aberrant T-Cell Marker Expression on Diffuse Large B-Cell Lymphoma Cells

Yuhko Suzuki, Tsutomu Yoshida, Guoqin Wang et al. · Acta Haematologica · 2013 · 22 citations · Full text

Medicine, Hematology, Pathology +11

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