Concepedia

Chinami Marushima

CM

3

Publications

34

Citations

3

H-Index

2022

Active since

Affiliations

IBM (Canada)(Current)

IBM Research - Tokyo

Chinami Marushima is an author at IBM (Canada) specializing in microelectronics, materials engineering, and mechanical engineering.

Top concepts

EngineeringMicrostructureApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingMaterials EngineeringMechanical Engineering

Publications per year

2022–2022

3

Publications

3

Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package

Akihiro Horibe, Takahito Watanabe, Chinami Marushima et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 13 citations

Dbhi Silicon-bridge Structure, Engineering, Mechanical Engineering +20

Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

Chinami Marushima, Toyohiro Aoki, Koki Nakamura et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 11 citations

Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages

Akihiro Horibe, Chinami Marushima, Takahito Watanabe et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 10 citations

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