Toyohiro Aoki

Energy-Efficient 1060-nm Optical Link Operating up to 28 Gb/s

J. B. Héroux, Tomufumi Kise, M. Funabashi et al. · Journal of Lightwave Technology · 2015 · 32 citations

Free-space Optical Network, Photonics, Electrical Engineering +13

IMS (Injection Molded Solder) Technology with Liquid Photoresist for Ultra Fine Pitch Bumping

Toyohiro Aoki, Kazushige Toriyama, Hiroyuki Mori et al. · IMAPSource Proceedings · 2014 · 22 citations

Engineering, Mechanical Engineering, Fine Pitch +16

Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps

Katsuyuki Sakuma, Griselda Bonilla, Dale McHerron et al. · 2023 · 12 citations

Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

Chinami Marushima, Toyohiro Aoki, Koki Nakamura et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 11 citations