Concepedia

Takahito Watanabe

TW

Statistics

Publications

2

Citations

23

H-Index

2

Active since

2022

Affiliations

IBM Research - Tokyo(Current)

IBM (Canada)

Takahito Watanabe is an author at IBM Research - Tokyo specializing in materials engineering, electronic packaging, and microelectronics.

Top concepts

Publications per year

2022–2022

2

Publications

2

Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package

Akihiro Horibe, Takahito Watanabe, Chinami Marushima et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 13 citations

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Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages

Akihiro Horibe, Chinami Marushima, Takahito Watanabe et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 10 citations

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