Fumiaki Yamada - Concepedia

Author

Fumiaki Yamada

Association of Super-Advanced Electronics

Also Known As

F Yamada, F. YAMADA, F. Yamada, Fumiaki YAMADA, Fumiaki Yamada, Fumiaki Yamada Fumiaki Yamada, Fumiaki Yamada Jr., Yamada, F.

128

Publications

757

Citations

H-Index

Concepts

All Affiliations

Association of Super-Advanced Electronics IBM Research - Tokyo IBM (United States)Tohoku University Japan Atomic Energy Agency

About

Fumiaki Yamada is an author at Association of Super-Advanced Electronics specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	15	509
2	Applied Physics	8	8	272
3	Chemistry	2	2	106
4	Health Sciences	1	1	47
5	Biochemistry	1	1	47

Fumiaki Yamada

Publications

563

Citations

H-Index

Page 1

	Year	Citations
Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias M. Murugesan, Hisashi Kino, Hiroshi Nohira, EngineeringMechanical EngineeringIntegrated CircuitsWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2010	81
Sequential‐color LCD based on OCB with an LED backlight Fumiaki Yamada, Hajime Nakamura, Y. Sakaguchi, Journal of the Society for Information Display PhotonicsOptical MaterialsLaptop ComputerEngineeringDisplay Technology	2002	63
Kinetics of the reaction of methyl radicals with nitrogen dioxide Fumiaki Yamada, Irene R. Slagle, David Gutman Chemical Physics Letters EngineeringRadical (Chemistry)Organic ChemistryKinetics (Physics)Reaction Intermediate	1981	59
Kinetics of free radicals produced by infrared multiphoton-induced decompositions. 1. Reactions of allyl radicals with nitrogen dioxide and bromine Irene R. Slagle, Fumiaki Yamada, David Gutman Journal of the American Chemical Society Radical EmissionEngineeringChemical AnalysisAltmetric Attention ScoreOrganic Chemistry	1981	47
10 &#x00B5;m fine pitch Cu/Sn micro-bumps for 3-D super-chip stack Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, EngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)Small SizeElectronic Packaging	2009	39
Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, EngineeringComputer ArchitectureThermal ConductivityAppropriate Cooling SolutionAdvanced Packaging (Semiconductors)	2011	32
Minimizing the local deformation induced around Cu-TSVs and CuSn/InAu-microbumps in high-density 3D-LSIs M. Murugesan, Hiroshi Kobayashi, H. Shimamoto, EngineeringSevere Plastic DeformationSilicon On InsulatorStacked Lsi DieAdvanced Packaging (Semiconductors)	2012	27
Investigations of cooling solutions for three-dimensional (3D) chip stacks Keiji Matsumoto, Soichiro Ibaraki, Masaaki Sato, EngineeringComputer ArchitectureInterconnect (Integrated Circuits)RefrigerationAdvanced Packaging (Semiconductors)	2010	26
Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Journal of Electronic Packaging EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Maximum Principal StressAdvanced Packaging (Semiconductors)	2012	25
Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack, including the transient measurements Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, EngineeringComputer ArchitectureThermal ConductivityAdvanced Packaging (Semiconductors)Thermal Analysis	2012	23

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