Fumiaki Yamada

Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias

M. Murugesan, Hisashi Kino, Hiroshi Nohira et al. · 2010 · 81 citations

Engineering, Mechanical Engineering, Integrated Circuits +22

Sequential‐color LCD based on OCB with an LED backlight

Fumiaki Yamada, Hajime Nakamura, Y. Sakaguchi et al. · Journal of the Society for Information Display · 2002 · 63 citations

Photonics, Optical Materials, Laptop Computer +9

Kinetics of the reaction of methyl radicals with nitrogen dioxide

Fumiaki Yamada, Irene R. Slagle, David Gutman · Chemical Physics Letters · 1981 · 59 citations

Engineering, Radical (Chemistry), Organic Chemistry +6

Kinetics of free radicals produced by infrared multiphoton-induced decompositions. 1. Reactions of allyl radicals with nitrogen dioxide and bromine

Irene R. Slagle, Fumiaki Yamada, David Gutman · Journal of the American Chemical Society · 1981 · 47 citations

Radical Emission, Engineering, Chemical Analysis +17

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma et al. · 2009 · 39 citations

Engineering, Wafer Scale Processing, Advanced Packaging (Semiconductors) +18