Seiki Sakuyama

Effects of a Third Element on Microstructure and Mechanical Properties of Eutectic Sn-Bi Solder

Seiki Sakuyama, Toshiya Akamatsu, Keisuke Uenishi et al. · Transactions of The Japan Institute of Electronics Packaging · 2009 · 69 citations · Full text

Materials Engineering, Materials Science, Eutectic Tin-bismuth +15

Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 °C

Ran He, Masahisa Fujino, Masatake Akaike et al. · Applied Surface Science · 2017 · 21 citations

Materials Science, Chemical Engineering, Engineering +7

Multilayer Glass Substrate with High Density Via Structure for All Inorganic Multi-chip Module

Toshiki Iwai, Taiji Sakai, Daisuke Mizutani et al. · 2019 · 20 citations

Engineering, Computer Architecture, Integrated Circuits +20

A New Flip-Chip Bonding Method Using Ultra-Precision Cutting of Metal/Adhesive Layers

Taiji Sakai, Seiki Sakuyama, Masataka Mizukoshi · Journal of The Japan Institute of Electronics Packaging · 2008 · 18 citations · Full text

Engineering, Mechanical Engineering, Cut Au Bumps +16

Hybrid bonding technology with Cu-Cu/adhesives for high density 2.5D/3D integration

Taiji Sakai, Nobuhiro Imaizumi, Seiki Sakuyama · 2016 · 17 citations

Engineering, Mechanical Engineering, High Density Interconnection +18