Masatake Akaike

A Combined Process of Formic Acid Pretreatment for Low-Temperature Bonding of Copper Electrodes

Wenhua Yang, Masatake Akaike, Masahisa Fujino et al. · ECS Journal of Solid State Science and Technology · 2013 · 47 citations · Full text

Engineering, Electrode-electrolyte Interface, Formic Acid +16

Effect of Formic Acid Vapor <italic>In Situ</italic> Treatment Process on Cu Low-Temperature Bonding

Wenhua Yang, Masatake Akaike, Tadatomo Suga · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 36 citations

Materials Engineering, Materials Science, Chemical Engineering +14

Low temperature Cu-Cu direct bonding using formic acid vapor pretreatment

Wenhua Yang, Hiroyuki Shintani, Masatake Akaike et al. · 2011 · 31 citations

Materials Engineering, Materials Science, Chemical Engineering +12

Low temperature de-oxidation for copper surface by catalyzed formic acid vapor

Pei-Wen Chou, Jenn‐Ming Song, Zong-Yu Xie et al. · Applied Surface Science · 2018 · 28 citations

Materials Science, Chemical Engineering, Low Temperature De-oxidation +8

Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 °C

Ran He, Masahisa Fujino, Masatake Akaike et al. · Applied Surface Science · 2017 · 21 citations

Materials Science, Chemical Engineering, Engineering +7