Taiji Sakai

Modeling, design, fabrication and characterization of first large 2.5D glass interposer as a superior alternative to silicon and organic interposers at 50 micron bump pitch

Brett Sawyer, Hao Lü, Yuya Suzuki et al. · 2014 · 24 citations

Engineering, Device Integration, First Large 2.5D +21

Dosimetry Using a Localized Exposure System in the Millimeter-Wave Band for in vivo Studies on Ocular Effects

Kensuke Sasaki, Taiji Sakai, Tomoaki Nagaoka et al. · IEEE Transactions on Microwave Theory and Techniques · 2014 · 24 citations

Engineering, Mmw Energy Absorption, Antenna Distribution +17

Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 °C

Ran He, Masahisa Fujino, Masatake Akaike et al. · Applied Surface Science · 2017 · 21 citations

Materials Science, Chemical Engineering, Engineering +7

Multilayer Glass Substrate with High Density Via Structure for All Inorganic Multi-chip Module

Toshiki Iwai, Taiji Sakai, Daisuke Mizutani et al. · 2019 · 20 citations

Engineering, Computer Architecture, Integrated Circuits +20

A New Flip-Chip Bonding Method Using Ultra-Precision Cutting of Metal/Adhesive Layers

Taiji Sakai, Seiki Sakuyama, Masataka Mizukoshi · Journal of The Japan Institute of Electronics Packaging · 2008 · 18 citations · Full text

Engineering, Mechanical Engineering, Cut Au Bumps +16