Journal of The Japan Institute of Electronics Packaging

Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy.

Hisaaki Takao, Akira Yamada, Hideo Hasegawa et al. · 2002 · 41 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +11

FEM Analysis of Thermal Cycle Properties of the Substrates for Power Modules.

Yoshiyuki Nagatomo, Toshiyuki Nagase, Shoichi SHIMAMURA · 2000 · 27 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Convenient Debonding Strength Evaluation Based on the Intensity of Singular Stress for Adhesive Joints

N. Noda, Tatsujiro MIYAZAKI, Takumi Uchikoba et al. · 2014 · 27 citations · Full text

Engineering, Materials Engineering, Materials Science +14

Thermo-Viscoelastic Analysis for Warpage of Ball Grid Array Packages Taking into Consideration of Chemical Shrinkage of Molding Compound

Kiyoshi Miyake · 2004 · 26 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Proposal and Investigation of Unbalanced Dipole Antenna with Semicircular and Trapezoidal Radiators for UWB Radio

Fukuro Koshiji, Toshiya EGUCHI, Kōichi Sato et al. · 2007 · 26 citations · Full text

Engineering, Electrical Engineering, Antennas +12