Yoshiyuki Nagatomo - Concepedia

Author

Yoshiyuki Nagatomo

Mitsubishi Materials (Japan)

Also Known As

Yoshiyuki NAGATOMO, Yoshiyuki Nagatomo

Publications

226

Citations

H-Index

Concepts

All Affiliations

Mitsubishi Materials (Japan)The University of Tokyo Central Research Institute Kyushu University

About

Yoshiyuki Nagatomo is an author at Mitsubishi Materials (Japan) specializing in materials science, engineering, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	6	6	160
2	Materials Science	6	6	160
3	Applied Physics	5	5	133
4	Materials Engineering	4	4	60
5	Electrical Engineering	2	2	42

Yoshiyuki Nagatomo

Publications

183

Citations

H-Index

Page 1

	Year	Citations
Transmission Electron Microscope Observation of Cubic GaN Grown by Metalorganic Vapor Phase Epitaxy with Dimethylhydrazine on (001) GaAs Noriyuki Kuwano, Yoshiyuki Nagatomo, Kenki Kobayashi, Japanese Journal of Applied Physics Materials ScienceSemiconductorsAluminium NitrideWide-bandgap SemiconductorEngineering	1994	73
FEM Analysis of Thermal Cycle Properties of the Substrates for Power Modules. Yoshiyuki Nagatomo, Toshiyuki Nagase, Shoichi SHIMAMURA Journal of The Japan Institute of Electronics Packaging EngineeringEnergy EfficiencyCold WorkingPower ModulesMechanics Of Materials	2000	27
Atomic structures of a liquid-phase bonded metal/nitride heterointerface Akihito Kumamoto, Naoya Shibata, Keiichiro Nayuki, Scientific Reports	2016	23
Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications Shuji Nishimoto, S. Ali Moeini, T. Ohashi, Microelectronics Reliability Materials ScienceMaterials EngineeringEngineeringAdvanced Packaging (Semiconductors)Surface Science	2018	20
A new method for liquid-phase bonding of copper plates to aluminum nitride (AlN) substrates used in high-power modules Nobuyuki Terasaki, Touyou Ohashi, Yoshiyuki Nagatomo, Journal of Materials Science Materials in Electronics Materials ScienceMaterials EngineeringElectrical EngineeringCopper PlatesEngineering	2019	15
Direct-bonded aluminum on aluminum nitride substrates by transient liquid phase bonding Yoshirou Kuromitsu, Yoshiyuki Nagatomo, Kazuhiro Akiyama, Journal of the Ceramic Society of Japan Materials EngineeringMaterials ScienceAluminium NitrideAluminum NitrideHigh Temperature Materials	2017	14
Changes in Microstructure of Al/AlN Interface during Thermal Cycling Yoshiyuki Nagatomo, Takeshi Kitahara, Toshiyuki Nagase, MATERIALS TRANSACTIONS Aluminium NitrideEngineeringMechanical EngineeringSi ParticlesVacuum Device	2008	11

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