Publication | Closed Access
Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications
20
Citations
18
References
2018
Year
Materials ScienceMaterials EngineeringEngineeringAdvanced Packaging (Semiconductors)Surface ScienceApplied PhysicsHigh Temperature ApplicationsChip AttachmentElectronic PackagingDie-attach TechnologyMicroelectronics
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