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A new method for liquid-phase bonding of copper plates to aluminum nitride (AlN) substrates used in high-power modules

Materials ScienceMaterials EngineeringElectrical EngineeringCopper PlatesEngineeringAluminium NitrideLiquid-phase BondingSurface ScienceApplied PhysicsHigh-power ModulesHigh-performance MaterialElectronic PackagingMicroelectronicsMicrostructureCladding (Metalworking)