Nobuhiro Imaizumi

22.2 A 25Gb/s hybrid integrated silicon photonic transceiver in 28nm CMOS and SOI

Yanfei Chen, Masaya Kibune, Asako Toda et al. · 2015 · 68 citations

Photonics, Electrical Engineering, Optical Interconnects +15

Hybrid bonding technology with Cu-Cu/adhesives for high density 2.5D/3D integration

Taiji Sakai, Nobuhiro Imaizumi, Seiki Sakuyama · 2016 · 17 citations

Engineering, Mechanical Engineering, High Density Interconnection +18

Low temperature Cu-Cu direct bonding for 3D-IC by using fine crystal layer

Taiji Sakai, Nobuhiro Imaizumi, T. Miyajima · 2012 · 15 citations

Engineering, Mechanical Engineering, Fine Crystal Layer +19

Formation of solder cap on Cu pillar bump using formic acid reduction

M. Monta, K. Okiyama, T. Sakai et al. · 2012 · 13 citations

Materials Science, Formic Acid Reduction, Chemical Engineering +15

A low temperature Cu-Cu direct bonding method with VUV and HCOOH treatment for 3D integration

Taiji Sakai, Nobuhiro Imaizumi, Seiki Sakuyama · 2015 · 11 citations

Engineering, Mechanical Engineering, Chemistry +23