A comparative study of copper drift diffusion in plasma deposited a-SiC:H and silicon nitride

Diffusion of Metals in Silicon Dioxide

J. D. McBrayer, R.M. Swanson, T. W. Sigmon · Journal of The Electrochemical Society · 1986 · 528 citations

Natural Sciences, Materials Engineering, Materials Science +17

Multilevel interconnections for ULSI and GSI era

S. P. Murarka · Materials Science and Engineering R Reports · 1997 · 350 citations

Engineering, Computer Engineering, Electrical Engineering +14

Copper Transport in Thermal SiO2

Yosi Shacham‐Diamand, A. Dedhia, D. Hoffstetter et al. · Journal of The Electrochemical Society · 1993 · 241 citations

Engineering, Materials Engineering, Materials Science +17

Kinetics of copper drift in PECVD dielectrics

Alvin L. S. Loke, Changsup Ryu, C. Patrick Yue et al. · IEEE Electron Device Letters · 1996 · 100 citations

Engineering, Electrical Engineering, Materials Science +17

Excess silicon at the silicon nitride/thermal oxide interface in oxide–nitride–oxide structures

V. A. Gritsenko, Hei Wong, Jianbin Xu et al. · Journal of Applied Physics · 1999 · 87 citations

Engineering, Materials Engineering, Materials Science +17