IEEE Transactions on Nuclear Science · 1986 · 52 citations · 6 references
EngineeringComputer EngineeringElectrical EngineeringFault-tolerant ComputingMicroelectronicsSemiconductor DevicesBuilt-in Self-testDesign For TestabilityDevice CharacterizationDevice ReliabilityHardware Fault ToleranceTemperature MeasurementCmos ReliabilityLatch DesignLatchup MitigationSingle Event EffectsSingle Event Upset ModelingTemperature Dependence MeasurementTemperature SensitivityThermal Effects In Integrated Circuits
Equipment for testing microcircuits at elevated temperatures for Single Event Phenomena (SEP) such as upset (SEU) and latchup (SEL) has been developed and measurements on several device types have been performed. Very large changes in cross-section and threshold LET have been observed over the temperature range of 25°C to 120°C for SEU and SEL.
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