Electrodeposition of 3D microstructures on silicon

Abstract

Metal electrodeposition combined with resist micropatterning techniques provides a powerful tool for the fabrication of thick metallic microstructures. This paper discusses the main characteristics of the electrodeposition process and describes the specific properties of negative polyimide and positive photoresists. The innovative use of this technique is illustrated by the presentation of two realizations, an on-chip high-density array of electromagnets developed for high-performance printing heads, and a micromachined microphone. These realizations demonstrate that not only the real 3D electroplated microstructures are achievable but also the integration of electronics is possible on the same silicon substrate.