Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern

Electrochemical migration tests of solder alloys in pure water

Tatsuya Takemoto, R. M. Latanision, Thomas W. Eagar et al. · Corrosion Science · 1997 · 80 citations

Materials Science, Electrometallurgy, Chemical Engineering +5

Effect of surface finish material on printed circuit board for electrochemical migration

Bo‐In Noh, Jong-Bum Lee, Seung‐Boo Jung · Microelectronics Reliability · 2007 · 72 citations

Materials Science, Electrical Engineering, Chemical Engineering +12

Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems

Gábor Harsányi, George Inzelt · Microelectronics Reliability · 2001 · 68 citations

Electrical Engineering, Advanced Interconnection Systems, Engineering +10

Inkjet printed System-in-Package design and manufacturing

J. Miettinen, Ville Pekkanen, Kimmo Kaija et al. · Microelectronics Journal · 2008 · 67 citations

Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes

Bo‐In Noh, Jeong‐Won Yoon, Won-Sik Hong et al. · Journal of Electronic Materials · 2009 · 49 citations

Materials Science, Electrical Engineering, Chemical Engineering +12