Contact resistance and adhesion performance of ACF interconnections to aluminum metallization

Conductive Adhesives for Electronics Packaging

Microelectronics International · 2000 · 158 citations

Materials Science, Conductive Adhesives, Engineering +3

Mechanisms underlying the unstable contact resistance of conductive adhesives

Daoqiang Lu, Q.K. Tong, Ching‐Ping Wong · IEEE Transactions on Electronics Packaging Manufacturing · 1999 · 125 citations · Full text

Engineering, Mechanical Engineering, Unstable Contact Resistance +18

The contact resistance and reliability of anisotropically conductive film (ACF)

Myung-Jin Yim, Kyung-Wook Paik · IEEE Transactions on Advanced Packaging · 1999 · 123 citations

Materials Science, Materials Engineering, Engineering +14

Electrically conductive adhesives: a prospective alternative for SMD soldering?

J.C. Jagt, P. J. M. BERIS, G. F. C. M. Lijten · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 111 citations

Engineering, Mechanical Engineering, Smd Soldering +17

Influence of temperature and humidity on adhesion of underfills for flip chip packaging

Shuchang Luo, C.P. Wong · IEEE Transactions on Components and Packaging Technologies · 2005 · 83 citations

Engineering, Mechanical Engineering, Glass Material +17